Hightemp 5449 is a mineral-filled epoxy molding compound suitable for transfer molding components requiring good electrical and mechanical properties at high temperatures.

This material has good flow properties at relatively low molding pressures (25-75 psi) permitting molding and encapsulating of delicate components.

Hightemp 5449 contains no internal mold release, so that it has excellent adhesion and may adhere to metal surfaces. For this reason, molds should be thoroughly cleaned and coated with a good mold release before use.

Hightemp 5449 can be stored at room temperature for at least six months without appreciable change in properties.

Hightemp 5449 is available in various softening points. The lower the softening point, the lower the viscosity and the longer the molding cycle.

All grades are available in various colors, in approximately 25 gram pellets or in powder form.