Technicure® D-10
dicyandiamide containing 1% fumed silica as a flow control agent to inhibit clumping and improve flow. D-10 can also be ordered without a flow control agent or with different levels of a flow control agent, as necessary. Typically used with epoxy resins (EEW 190) between 6-8phr, the reactivity of dicyandiamide increases inversely proportional to the particle size. Additionally, dicyandiamide tends to react with epoxies at higher temperatures, >180C, unless an accelerator is used. Accelerators that have minimal effect on latency while decreasing the activation temperature to less than 100C can be used. Some suggested accelerators for D-10 include Technicure LC-80, Technicure LC-100 any of the substituted ureas, including Technicure MDU-11, Technicure PDU-17 or Technicure TDU-20. These accelerators will decrease the activation temperature of dicyandiamide, without compromising, and perhaps enhancing performance properties.
ADVANTAGES
- Long Pot Life with epoxy resins
- Easily Accelerated
- High Tg's
- Excellent Adhesion to a variety of substrates
- Used in Powder Coatings, Prepregs as well as Adhesives
General Properties
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Technical Datasheet (English)
Download DocumentProcessing
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