CMP SNOWSPHERE Spherical Fused Silica Powder is manufactured with CMP`s sophisticated technology, well designed flow process and cutting edge machinery and equipment. Snowshpere Spherical Fused Silica Powder has a high rate of spheroidization, high purity and accurate sizes. It is designed to provide high performance in applications such as epoxy sealing material for encapsulation of electronic products and chip material, as well as for bonding and potting, glues, and applications in inks and in PVC.

CMP SNOWSPHERE Spherical silica powder can be incorporated as high as 90% as a functional fillers in epoxy molding compound ( EMC ). Its performance has a important impact on the end product quality, where its primary role is to improve the thermal conductivity, decrease the coefficient of thermal expansion and control the shrinkage rate.